The International Microwave Symposium (IMS) taking place in person June 19-24, 2022 in Denver is the flagship event dedicated to all things microwaves and RF. The week includes the IEEE MTT-S Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG). DeepSig’s Chief Technology Officer Tim O’Shea will be speaking on an IEEE panel session June 21, from 4 p.m. – 5:15 p.m. (MDT).
The session titled “Will Flexibility and Digital Bottlenecks Break 6G?” brings together experts from industry and academia to discuss various challenges in the development of 6G systems. Panelists will focus on the open issues and opportunities towards 6G, particularly from the digital point of view. Topics to be discussed include digital signal processing challenges; architectures for ultra-reliable and low- latency communications; efficiency, linearization, autonomy and sustainability aspects; as well as analog and digital signal processing tradeoffs, in particular for ultrawideband signals.
“Use cases envisioned for 6G and their associated performance metrics will require new approaches and technologies to achieve the needed efficiency and flexibility. The ever-increasing bandwidths, bit rates and network densification necessitate higher degrees of digitization and, more recently, the adoption of AI/ML techniques to cope with the complexity and adaptability. Besides the important advantages of digitization in terms of flexibility and integration, several efficiency and performance bottlenecks still remain, leading to the question: Should we do more in the RF/analog domain due to digital performance bottlenecks?” – The International Microwave Symposium
Complete list of panelists include:
- Moderator: Aarno Pärssinen, Professor, Research Area Lead in 6G Flagship, University of Oulu
- Timothy O’Shea, CTO, DeepSig, Research Assistant Professor at Virginia Tech
- Raghu M. Rao, Director, Wired and Wireless Group at AMD Xilinx
- Charlie Jianzhong Zhang, Senior Vice President of Samsung Research America
- Christian Fager, Head of Microwave Electronics Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology